ASM Pacific Technology Limited, a Hong Kong listed semiconductor packaging giant, has signed a cooperation agreement with Chengdu High-tech Zone to invest USD30 million in setting up a semiconductor equipment research and development center in Chengdu.

According to the agreement, ASM will inject more than USD30 million in the first schedule to establish a semiconductor packaging equipment R&D base in Chengdu. The company plans to build two R&D buildings in Chengdu's Tianfu Software Park in the coming three years.

Based in Hong Kong, ASM is reported to be the world's largest assembly and packaging equipment supplier for the semiconductor industry. It has R&D centers in Shenzhen, Singapore and Malaysia. In 2007, its business revenue reached up to HKD6 billion.